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 TSM35N03
Pin assignment: 1. Gate 2. Drain 3. Source
Preliminary
N-Channel Enhancement Mode MOSFET
VDS = 30V ID = 50A RDS (on), Vgs @ 10V, Ids @ 30A = 8.5m RDS (on), Vgs @ 4.5V, Ids @ 30A = 13m
Features
Advanced trench process technology High Density Cell Design for Ultra Low On-Resistance Fully Characterized Avalanche Voltage and Current Specially Designed for DC/DC Converters and Motor Drivers
Block Diagram
Ordering Information
Part No. TSM35N03CP Packing Tape & Reel Package TO-252
Absolute Maximum Rating (TA = 25 oC unless otherwise noted)
Parameter
Drain-Source Voltage Gate-Source Voltage Continuous Drain Current Pulsed Drain Current Maximum Power Dissipation Operating Junction Temperature Operating Junction and Storage Temperature Range Single Pulse Drain to Source Avalanche Energy (VDD = 100V, VGS=10V, IAS=2A, L=10mH, RG=25) TA = 25 oC TA = 100 C
o
Symbol
VDS VGS ID IDM PD TJ TJ, TSTG EAS
Limit
30 20 50 350 57 23 +150 -55 to +150 300
Unit
V V A W W/oC
o o
C C
mJ
Thermal Performance
Parameter
Lead Temperature (1/8" from case) Junction-to-case Thermal Resistance Junction to Ambient Thermal Resistance (PCB mounted) Note: 1. Maximum DC current limited by the package 2. 1-in2 2oz Cu PCB board
Symbol
TL Rjc Rja
Limit
10 2.2 50
Unit
S
o
C/W
TSM35N03
1-3
2005/04 rev. A
Electrical Characteristics
TJ = 25 oC, unless otherwise noted
Parameter Static
Drain-Source Breakdown Voltage Drain-Source On-State Resistance Drain-Source On-State Resistance Gate Threshold Voltage Zero Gate Voltage Drain Current Gate Body Leakage Gate Resisrance Forward Transconductance
Conditions
Symbol
Min
Typ
Max
Unit
VGS = 0V, ID = 250uA VGS = 4.5V, ID = 30A VGS = 10V, ID = 30A VDS = VGS, ID = 250uA VDS = 24V, VGS = 0V VGS = 20V, VDS = 0V
BVDSS RDS(ON) RDS(ON) VGS(TH) IDSS IGSS Rg
30 --1.0 -----
-10.0 6.5 1.6 -----
-13.0 8.5 3.0 1.0 100 ---
V m m V uA nA
VDS =10V, ID = 35A
gfs
S
Dynamic
Total Gate Charge Gate-Source Charge Gate-Drain Charge Turn-On Delay Time Turn-On Rise Time Turn-Off Delay Time Turn-Off Fall Time Input Capacitance Output Capacitance Reverse Transfer Capacitance VDS = 15V, VGS = 0V, f = 1.0MHz VDD = 15V, RL = 15, ID = 1A, VGEN = 10V, RG = 24 VDS = 15V, ID = 35A, VGS = 10V Qg Qgs Qgd td(on) tr td(off) tf Ciss Coss Crss ----------24 5.4 4.0 15 3.2 36 4.8 1940 312 122 ----------pF nS nC
Source-Drain Diode
Max. Diode Forward Current Diode Forward Voltage IS = 20A, VGS = 0V Note: 1. pulse test: pulse width <=300uS, duty cycle <=2% 2. Negligible, Dominated by circuit inductance. IS VSD ---0.87 50 1.5 A V
TSM35N03
2-3
2005/04 rev. A
TO-252 Mechanical Drawing
J A
E F
DIM A B C D E F G H I J TO-252 DIMENSION MILLIMETERS INCHES MIN MAX MIN MAX 6.570 6.840 0.259 0.269 9.250 10.400 0.364 0.409 0.550 0.700 0.022 0.028 2.560 2.670 0.101 0.105 2.300 2.390 0.090 0.094 0.490 0.570 0.019 0.022 1.460 1.580 0.057 0.062 0.520 5.340 1.460 0.570 5.550 1.640 0.020 0.210 0.057 0.022 0.219 0.065
I B
G D C H
TSM35N03
3-3
2005/04 rev. A


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